半导体激光焊接机

Abstract

The utility model relates to a semiconductor laser welding machine. The semiconductor laser welding machine comprises a power module, a main control module, an optical module and a refrigerator, wherein the optical module and the refrigerator are connected with the main control module. The control module comprises a microprocessor and a direct-current power source, and the power module is a 40W integrated laser power source which is provided with a current purifying module, an overvoltage protection module, an undervoltage protection module, an overheating protection module and a hardware double protection module. The semiconductor laser welding machine has the advantages of being high in laser beam quality, high in conversion efficiency, high in welding speed and convenient to install and move, and light spots are even and fine, the welding machine is compact and small in structure and stable in performance, as air cooling type heat dissipation is adopted, a refrigerant is not needed, and the semiconductor laser welding machine is environmentally friendly and easy to maintain.
本实用新型所述的一种半导体激光焊接机,其包括电源模块、主控模块、与主控模块连接的光学模块及制冷器,所述控制模块包括微处理器及直流电源,所述电源模块为40W一体化激光电源,该40W一体化激光电源具有电流净化模块、过压保护模块、欠压保护模块、过热保护模块、硬件双重保护模块。本实用新型所述的半导体激光焊接机,具有光束质量好,转化效率高,光斑均匀细小,焊接速度快,安装移动方便等优点,设备结构紧凑小巧,性能稳定,采用风冷式散热,不需要制冷剂,环保且维护简单。

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