プリント基板の製造方法

Method for producing printed circuit board

Abstract

(57)【要約】 【課題】銅導体パターンと絶縁樹脂との間の接着力が向 上し、ハローイングの発生を抑えた多層プリント配線板 等の信頼性の高い電子部品を製造すること。 【解決手段】銅イオン、銅イオンの錯化剤、還元剤並び にGeの化合物及びSiの化合物からなる群から選ばれ た少なくとも1種の化合物を含有する無電解銅めっき液 に被めっき物を浸漬することにより、銅導体パターン3 に突起を有する銅めっき層4を形成するようにした無電 解銅めっき方法。
PROBLEM TO BE SOLVED: To produce electronic parts high in reliability such as a multilayer printed circuit board in which the adhesive properties between copper conductor patterns and an insulating resin is improved, and the generation of holoing suppressed. SOLUTION: In this electroless copper plating method, the object to be plated is dipped into an electroless copper plating solution containing copper ions, a complexing agent for copper ions, a reducing agent and at least one compound selected from the groups consisting of Ge compounds and Si compounds, by which copper plating layers 4 having projections are formed on copper conductor patterns 3.

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    Publication numberPublication dateAssigneeTitle
    JP-2010524227-AJuly 15, 2010エルジー・ケム・リミテッド導電パターンが黒化処理された電磁波遮蔽ガラスおよびその製造方法
    WO-03098985-A1November 27, 2003Japan Science And Technology Corporation, Toppan Printing Co., Ltd., Zeon CorporationMethod for forming multilayer circuit structure and base having multilayer circuit structure